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product structure silicon monolithic integrated circuit this product is not designed for pr otection against radioactive rays . 1/17 tsz02201-0t2t0an00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 08.feb.2013 rev.001 tsz22111 ? 14? 001 www.rohm.com datashee t single-output ldo regulator 35v voltage resistance 1a ldo regulator BD00C0AWFPS-M general description the BD00C0AWFPS-M is a low-saturation regulator. the output voltage can be arbitrarily configured depending on the external resistor combination. this ic has a built-in over-current pr otection circuit that prevents the destruction of the ic due to output short circuit and a thermal shutdown circuit t hat protects the ic from thermal damage due to overloading. features ? output current capability : 1a ? high output voltage precision : 1% (ta=25 ) ? low saturation with pdmos output ? built-in over-current protec tion circuit that prevents the destruction of the ic due to output short circuit ? built-in thermal shutdown circuit for protecting the ic from thermal damage due to overloading ? low esr capacitor applications ? automotive (audio system, navigation system and etc.) key specifications ? supply voltage: 4.0v to 26.5v ? output voltage range: 3.0v to 15.0v ? output current: 1a ? output voltage precision(ta=25 ): 1% (-40 ta +105 ): 3% ? operating temperature range: -40 ta +105 package w(typ.) d(typ.) h(max.) to252s-5 6.50mm 9.50mm 1.30mm typical application circuit figure 1. typical application circuit to252s-5 vcc ctl gnd adj vo cout cin vcc r 1 r 2
datasheet datasheet 2/17 tsz02201-0t2t0an00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 08.feb.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 BD00C0AWFPS-M pin configuration pin description pin no. symbol function 1 ctl output control pin 2 v cc power supply pin 3 n.c. n.c. pin 4 v o output pin 5 adj variable pin fin gnd gnd n.c.pin can be open. because it is n't connect it inside of ic. block diagram figure 2. pin configuration a dj ctl n.c. v o gnd fin driver tsd vref ocp 1 v cc 2 3 4 5 - + vref : bandgap reference ocp : over current protection circuit tsd : thermal shutdown circuit driver : power transistor driver figure 3. block diagram to252s-5 (top view) 1 2 5 3 4
datasheet datasheet 3/17 tsz02201-0t2t0an00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 08.feb.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 BD00C0AWFPS-M absolute maximum ratings (ta=25 ) parameter symbol limits unit supply voltage *1 v cc -0.3 +35.0 v output control voltage *2 v ctl -0.3 +35.0 v power dissipation *3 pd 1.3 w operating temperature range topr -40 +105 storage temperature range tstg -55 +150 maximum junction temperature tjmax +150 *1 not to exceed pd. *2 the order of starting up power supply (vcc) and ctl pin doesn't have either in the problem within the range of the operation power-supply voltage ahead. *3 to252s-5 : 70 70 1.6mm glass-epoxy pcb. if ta 25 , reduce by 10.4mw/ recommended operating ratings (-40 ta +105 ) parameter symbol min. max. unit supply voltage vcc 4.0 25.0 v output control voltage v ctl 0 25.0 v output current io 0 1.0 a output voltage vo 3.0 15.0 v electrical characteristics ta = 2 5 , vcc=10v, v ctl =5v, io=50ma, vo=5.0v output setting (resistor valued used between adj and vo is 56.7k ? , while resistor value used between adj and gnd is 10k ) parameter symbol guaranteed limit unit conditions min. typ. max. adj terminal voltage vadj 0.742 0.750 0.758 v unless otherwise specified, -40 ta +105 , vcc=10v, v ctl =5v, io=0ma, vo=5.0v output setting (resistor valued used between adj and vo is 56.7k , while resistor value used between adj and gnd is 10k) parameter symbol guaranteed limits unit conditions min. typ. max. shutdown current isd 0 10 a v ctl =0v circuit current ib 0.5 2.5 ma adj terminal voltage vadj 0.727 0.750 0.773 v i o =50ma dropout voltage vd 0.3 1.0 v v cc =v o 0.95, i o =500ma ripple rejection r.r. 45 55 db f=120hz, input voltage ripple =1vrms i o =100ma line regulation reg.i 20 80 mv v cc =6 25v load regulation reg.l v o 0.010 v o 0.015 v i o =5ma 1a ctl on mode voltage vthh 2.0 v active mode ctl off mode voltage vthl 0.8 v off mode ctl bias current i ctl 25 50 a
datasheet datasheet 4/17 tsz02201-0t2t0an00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 08.feb.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 BD00C0AWFPS-M typical performance curves BD00C0AWFPS-M (vo=5.0v output setting) unless otherwise specified, -40 ta +105 , vcc=10v, v ctl =5v, io=0ma, vo=5.0v (resistor valued used between adj and vo is 56.7k , while resistor value used between adj and gnd is 10k) 0 1 2 3 4 5 6 02468101214161820222426 output voltage: vo [v] supply voltage: vcc [v] ta=-40 ta=25 ta=105 0 1 2 3 4 5 6 02468101214161820222426 output voltage: vo [v] supply voltage: vcc [v] ta=-40 ta=25 ta=105 0 3 6 9 12 15 18 0 2 4 6 8 101214161820222426 shutdown current: isd [ a] supply voltage: vcc [v] ta=-40 ta=25 ta=105 figure 4. circuit current (ifeedback_r P 75a) figure 5. shutdown current figure 6. line regulation (io=0ma) figure 7. line regulation (io=500ma) 0.0 0.2 0.4 0.6 0.8 1.0 0 2 4 6 8 101214161820222426 circuit current: i b+ifeedback_r [m a] supply voltage: vcc [v] ta=-40 ta=25 ta=105
datasheet datasheet 5/17 tsz02201-0t2t0an00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 08.feb.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 BD00C0AWFPS-M typical performance curves - continued 0 1 2 3 4 5 6 -40-20 0 20406080100 output voltage:vo [v] ambient temperature:ta[ ] 0 10 20 30 40 50 60 70 80 10 100 1000 10000 100000 1000000 ripple rejection: r.r. [db] frequency: f [hz] ta=-40 ta=25 ta=105 0 100 200 300 400 500 600 700 800 900 1,000 0 200 400 600 800 1000 dropout voltage: vd [mv] output current: io [m a] ta=-40 ta=25 ta=105 0 1 2 3 4 5 6 0 400 800 1200 1600 2000 2400 output voltage: vo [v] output current: io [m a] ta=-40 ta=25 ta=105 figure 8. load regulation figure 9. dropout voltage (vcc=4.75v) (lo=0ma 1000ma) figure 10. ripple rejection (lo=100ma) figure 11. output voltage temperature characteristic
datasheet datasheet 6/17 tsz02201-0t2t0an00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 08.feb.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 BD00C0AWFPS-M typical performance curves - continued 0 20 40 60 80 100 120 140 160 180 02468101214161820222426 ctl bias current: i ctl [ a] control voltage: v ctl [v] ta=-40 ta=25 ta=105 0 1 2 3 4 5 6 0 2 4 6 8 10 12 14 16 18 20 22 24 26 output voltage:vo [v] control voltage: v ctl [v] ta=-40 ta=25 ta=105 0.0 0.2 0.4 0.6 0.8 1.0 0 200 400 600 800 1000 circuit current: ib+ifeedback_r [ma] output current: io [m a] ta=-40 ta=25 ta=105 0 1 2 3 4 5 6 130 140 150 160 170 180 190 output voltage:vo [v] ambient temperature:ta [ ] figure 12. circuit current (lo=0ma 1000 ma) ( ifeedback_r P 75a) figure 13. ctl voltage vs ctl current figure 14. ctl voltage vs output voltage figure 15. thermal shutdown circuit characteristic
datasheet datasheet 7/17 tsz02201-0t2t0an00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 08.feb.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 BD00C0AWFPS-M measurement setup for typical performance curves measurement circuit of figure 4 a vcc ctl gnd vo adj 1f 56.7k 10k 1f vcc ctl gnd vo adj 1f 5v 56.7k v 10k 1f vcc ctl gnd vo adj 1f 5v 56.7k v 500ma 10k 1f vcc ctl gnd vo adj 1f 5v 56.7k 100ma 10v 1vrms 10k 1f vcc ctl gnd vo adj 1f 5v 56.7k 10v v 10k 1f vcc ctl gnd vo adj 1f 10v 56.7k a 10k 1f vcc ctl gnd vo adj 1f 10v 56.7k v 10k 1f vcc ctl gnd vo adj 1f 5v 56.7k 10v v 10k 1f measurement circuit of figure 5 measurement circuit of figure 6 measurement circuit of figure 7 measurement circ uit of figure 8 measurement circuit of figure 9 measurement circuit of figure 10 measurement circui t of figure 11 measurement circuit of figure 12 measurement circuit of figure 13 measurement circ uit of figure 14 measurement circuit of figure 15
datasheet datasheet 8/17 tsz02201-0t2t0an00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 08.feb.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 BD00C0AWFPS-M vcc gnd vcc gnd application examples applying positive surge to the v cc pin if the possibility exists that surges higher than 35.0v will be applied to the v cc pin, a zenar diode should be placed between the vcc pin and gnd pin as shown in the figure below. applying negative surge to the v cc pin if the possibility exists that negative surges lower than the gnd are applied to the v cc pin, a schottky diode should be place between the vcc pin and gnd pin as shown in the figure below. implementing a protection diode if the possibility exists that a large inductive load is connected to the output pin resulting in back-emf at time of startup a nd shutdown, a protection diode should be placed as shown in the figure below. figure 16. figure 17. figure 18. vo
datasheet datasheet 9/17 tsz02201-0t2t0an00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 08.feb.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 BD00C0AWFPS-M 0 1 2 3 4 5 0 255075100125150 ambient temperature: ta( ) power dissipation pd(w) 1.30 power dissipation mounted on a rohm standard board board size : 70mm70mm1.6mm copper foil area :7mm7mm to252s-5 ja=96.2( /w) ic mounted on a rohm standard board board size 70mm70mm1.6mm copp er are a 7mm7mm :2-layer pcb (copper foil area on the reverse side of pcb:15mm15mm) :2-layer pcb (copper foil area on the reverse side of pcb:70mm70mm) :4-layer pcb (copper foil on the reverse side of pcb:70mm70mm) : ja=67.6 /w : ja=35.7 /w : ja=26.0 /w 0 1 2 3 4 5 0 255075100125150 ambient temperature: ta( ) power dissipation pd w) 1.85 3.50 4.80 figure 19. figure 20. to252s-5 to252s-5
datasheet datasheet 10/17 tsz02201-0t2t0an00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 08.feb.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 BD00C0AWFPS-M refer to the heat mitigation characteristics illustrated in figure 19 and figure 20 when using the ic in an environment of t a 25c. the characteristics of the ic are greatly influenced by the operating temperature, and it is necessary to operate under the maximum junction temperature timax. even if the ambient temperature ta is at 25c it is possibl e that the junction temperature tj reaches high temperatures. therefore, the ic should be operated within the power dissipation range. figure 19 and figure 20 show the acceptable power dissipati on characteristic curves of to252s-5 package. even when the ambient temperature ta is a normal temperature (25 ), the chip (junction) temperature tj may be quite high so please operate the ic at temperatures less than the acceptable loss pd. the following method is used to calculate the power consumption pc (w). pc=(vcc-vo)io+ v cc ib acceptable loss pd pc the load current io is obtained by operating the ic within the power dissipation range. thus, the maximum load current iomax for the applied voltage vcc can be calculated during the thermal design process. calculation example) with to252s-5,ta=85 ,vcc=10v, vo=5v at ta=85 with figure 20 condition, the calculation shows that ca about 500ma of output current is possible at 5v potential difference across input and output. the thermal calculation shown above should be taken into consi deration during the thermal design in order to keep the whole operating temperature range within the power dissipation range. in the event of shorting (i.e. v o and gnd pins are shorted) the power consumptio n pc of the ic can be calculated as follows: pc=v cc (ib+ishort) pd v cc ib (please refer to figure.12 for ib.) (please refer to figure.8 for ishort.) figure 20 : ja=26.0 /w -38.4mw/ 25 =4.80w 85 =2.496w i o i o 498.2ma (ib: 0.5ma) 2.496 10ib 5 v cc : input voltage v o : output voltage i o : load current ib : circuit current ishort : short current i o v cc vo
datasheet datasheet 11/17 tsz02201-0t2t0an00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 08.feb.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 BD00C0AWFPS-M input / output equivalent circuit diagrams output voltage configuration method please connect resistors r 1 and r 2 (which determines the output voltage) as shown in figure 22. please be aware that the offset due to the current that flows from the adj terminal becomes large when resistors values are large. due to this, resistance ranging from r 1 =5k ? to 10k ? is highly recommend for r1. v o P v adj (r 1 +r 2 )/r 1 figure 22. vcc ic ctl 200k 200k 1k v cc terminal ctl terminal vcc vo 15k figure 21. v o terminal adj terminal
datasheet datasheet 12/17 tsz02201-0t2t0an00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 08.feb.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 BD00C0AWFPS-M operational notes 1. absolute maximum ratings exceeding the absolute maximum rating for supply voltage, oper ating temperature or other parameters can result in damages to or destruction of the chip. in this event it also becomes impossible to determine the cause of the damage (e.g. short circuit, open circuit, etc). therefore, if any specia l mode is being considered with values expected to exceed the absolute maximum ratings, implementing physical safety measures, such as adding fuses, should be considered. 2. the electrical characteristics given in this specification may be influenced by conditions such as temperature, supply voltage and external components. transient characteristics should be sufficiently verified.. 3. gnd electric potential keep the gnd pin potential at the lowest (minimum) level under any operating condition. furthermore, ensure that, including the transient, none of the pin?s voltages are less than the gnd pin voltage. 4. ground wiring pattern when both a small-signal gnd and a high current gnd are present, single-point grounding (at the set standard point) is recommended. this in order to separate the small-signal and high current patterns and to ensure that voltage changes stemming from the wiring resistance and high current do not cause any voltage change in the small-signal gnd. similarly, care must be taken to avoid wiring pattern fluctuations in any connected external component gnd. 5. inter-pin shorting and mounting errors ensure that when mounting the ic on the pcb the direction and position are correct. incorrect mounting may result in damaging the ic. also, shorts caused by dust entering betw een the output, input and gnd pin may result in damaging the ic. 6. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 7. inspection using the set board the ic needs to be discharged after each inspection proce ss as, while using the set board for inspection, connecting a capacitor to a low-impedance pin may cause stress to the ic. as a protection from static electricity, ensure that the assembly setup is grounded and take sufficient caution with transportation and storage. also, make sure to turn off the power supply when connecting and disconnecting the inspection equipment. 8. power dissipation (pd) should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximu m rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 9. thermal design the power dissipation under actual operating conditions should be taken into consideration and a sufficient margin should be allowed for in the thermal design. on the reverse si de of the package this product has an exposed heat pad for improving the heat dissipation. use both the front and reverse side of the pcb to increase the heat dissipation pattern as far as possible. the amount of heat generated depends on the voltage difference across the input and output, load current, and bias current. therefore, when actually using the chip, ensure that the generated heat does not exceed the pd rating. tjmax: maximum junction temperature=150[ ], ta: peripheral temperature [ ], ja : thermal resistance of package-ambience[ /w], pd : package power dissipation [w], pc: power dissipation [w], vcc: input voltage, vo: output voltage, io: load, ib : circuit current package power dissipation : pd (w) = (tjmax-ta) / ja power dissipation : pc (w) = (v cc -v o ) i o + v cc ib 10. v cc pin insert a capacitor(vo 5.0v:capacitor 1f, 3.0v vo 5.0v:capacitor 2.2f) between the v cc and gnd pins. choose the capacitance according to the line between the power smoothing circuit and the v cc pin. selection of the capacitance also depends on the application. verify the application and allow for sufficient margins in the design. we recommend using a capacitor with excellent voltage and temperature characteristics. electric capacitance ceramic capacitors, low esr capacitor ic
datasheet datasheet 13/17 tsz02201-0t2t0an00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 08.feb.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 BD00C0AWFPS-M 11. output pin in order to prevent oscillation, a capacitor needs to be placed between the output pin and gnd pin. we recommend a capacitor with a capacitance of more than 1 f. electrolytic, tantalum and ceramic capacitors can be used. when selecting the capacitor ensure that the capacitance of more than 1 f is maintained at the intended applied voltage and temperature range. due to changes in temperature, the capac itance can fluctuate possibly resulting in oscillation. for selection of the capacitor refer to the cout esr vs. io. the stable operation range given in the reference data is based on the standalone ic and resistive load. for actual applications the stable operating range is influenced by the pcb impedance, input supply impedance and load impedance. theref ore verification of the final operating environment is needed. when selecting a ceramic type capacitor, we recommend usi ng x5r, x7r or better with excellent temperature and dc-biasing characteristics and high voltage tolerance. also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying that the actual application meets with the required specification. 12. ctl pin do not set the voltage level on the ic's enable pin in between vthh and vthl. do not leave it floating or unconnected, otherwise, the output voltage would be unstable. 13. rapid variation in v cc voltage and load current in case of a rapidly changing input voltage, transients in the output voltage might occur due to the use of a mosfet as output transistor. although the actual application might be the cause of the transients, the ic input voltage, output current and temperature are also possible causes. in case prob lems arise within the actual operating range, use countermeasures such as adjusting the output capacitance. 14. minute variation in output voltage in case of using an application susceptible to minute changes to the output voltage due to noise, changes in input and load current, etc., use countermeasures such as implementing filters. 15. over current protection circuit (ocp) this ic incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operati on or transitioning of the protection circuit. cout_esr vs. i o (reference data) cin vs. cout(reference data) operation note 11 measurement circuit 4.0v v cc 26.5v 3.0v v o 15.0v -40 ta +105 5k ? r 1 10k ? 2.2f cin 100f 1f cout 100f 4.0v v cc 26.5v 3.0v v o 15.0v -40 ta +105 0a i o 1a 5k ? r 1 10k ? 1 10 100 110100 cout f cin f stable operating region 2.2 u ns t a bl e o p eratin g re g ion 1 10 100 110100 cout(f) cinf stable operating region 6.0v v cc 26.5v 5.0v v o 15.0v -40 ta +105 0a i o 1a 5k ? r 1 10k ? v cc ctl v o adj gnd v ctl (5.0v) cin (1f or higher) v cc (4.0v to 26.5v) r 1 (5k to 10k ) r 2 io (rout) cout (1f or higher) esr (0.001 or higher) 0.001 0.01 0.1 1 10 100 0 200 400 600 800 1000 io(ma) cout_esr(? unstable operating region stable operating region
datasheet datasheet 14/17 tsz02201-0t2t0an00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 08.feb.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 BD00C0AWFPS-M 16. thermal shutdown circuit (tsd) this ic incorporates and integrated thermal shutdown circuit to prevent heat damage to the ic. normal operation should be within the power dissipation rating, if however the rating is exceeded for a continued period, the junction temperature (tj) will rise and the tsd circuit will be activated and turn all output pins off. after the tj falls below the tsd threshold the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 17. in some applications, the v cc and pin potential might be reversed, possibly resulting in circuit internal damage or damage to the elements. for example, while the external capacitor is charged, the v cc shorts to the gnd. use a capacitor with a capacitance with less than 1000 f. we also recommend using reverse polarity diodes in series or a bypass between all pins and the v cc pin. 18. this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p/n junctions are formed at the intersection of these p layers with the n layers of other elements to create a variety of parasitic elements. for example, in case a resistor and a transistor are connected to the pins as shown in the figure below then: the p/n junction functions as a parasitic diode when gnd > pin a for the resistor, or gnd > pin b for the transistor. also, when gnd > pin b for the transistor (npn), the parasitic diode described above combines with the n layer of the other adjacent elements to operate as a parasitic npn transistor. parasitic diodes inevitably occur in the structure of the ic. their operation can result in mutual interference between circuits and can cause malfunctions and, in turn, physical dam age to or destruction of the chip. therefore do not employ any method in which parasitic diodes can operate such as applying a voltage to an input pin that is lower than the (p substrate) gnd.
datasheet datasheet 15/17 tsz02201-0t2t0an00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 08.feb.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 BD00C0AWFPS-M ordering information b d 0 0 c 0 a w f p s - m e 2 output voltage 00:variable current capacity c0a 1a shutdown switch w : with switch package fps to252s-5 packaging specification e2: embossed tape and reel marking diagram to252s-5 (top view) part number marking lot number 00c0aw
datasheet datasheet 16/17 tsz02201-0t2t0an00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 08.feb.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 BD00C0AWFPS-M physical dimension, tape and reel information package name to252s-5 direction of feed 1pin reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the lower left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 ( )
datasheet datasheet 17/17 tsz02201-0t2t0an00050-1-2 ? 2013 rohm co., ltd. all rights reserved. 08.feb.2013 rev.001 www.rohm.com tsz22111 ? 15? 001 BD00C0AWFPS-M revision history date revision changes 08.feb.2013 001 new release
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. notice general precaution 1. before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2. all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1. if you intend to use our products in devices requirin g extremely high reliability (such as medical equipment, aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. other precaution 1. the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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